The hot isostatic pressing (HIP) process of SiC/Ti60 composites was simulated using ABAQUS finite element simulation software. A representative volume element (RVE) model for SiC_f /Ti60 composites with a fiber volume fraction of 25% was established to analyze the hot isostatic pressing densification process and residual stress distribution characteristics of the composites. The analysis results show that the plastic deformation and densification of the composites mainly occur during the thermal and pressure holding stages, and the thermal residual stress characteristics of the interface layer are significantly different from those of the titanium alloy matrix and SiC fibers. The circumferential stress of the TiC reaction layer in the interface layer has a sudden change compared to that of the SiC fiber, and the compressive stress value increases by about 205 MPa. The axial stress on the C-coating and TiC interface layer approaches zero, reducing the stress gradient between the SiC fiber (compressive stress) and the substrate (tensile stress). The thickness of the C layer in composite materials can affect the thermal residual stress of the interface layer. When the thickness of the C layer increases from 1.5 μm to 2.5 μm, the radial stress in the interface layer and surrounding areas decreased by 7 MPa, and the circumferential stress in the TiC interface layer decreased by 20 MPa. Increasing the holding temperature of hot isostatic pressing can enhance the densification effect, but it will slightly increase the residual stress in the interface layer and adjacent areas.