SiC_p/Al composites play an important role in aerospace, precision instruments and other fields, however, higher cutting force and cutting temperature will appear in the machining process, thus reducing the surface quality and precision of the turning process. In order to explore the effect of ultrasonic elliptic vibration and turning technological parameters on SiC_p/Al turning, the SiC_p/Al ultrasonic elliptic vibration finite element turning simulation model was established in ABAQUS, the SiC_p/Al micro-geometric modeling method was optimized, the turning model was verified and the simulation experiment was carried out. The results show that the ultrasonic elliptic vibration turning can effectively reduce the defects such as subsurface damage and surface crack. It is found that with the increase of cutting speed and cutting depth, the main cutting force and cutting temperature of conventional and ultrasonic turning increase; The ultrasonic elliptical vibration technology can effectively reduce the main cutting force and cutting temperature in SiCp/Al turning process. Among the selected parameters, the ultrasonic effect reduces the cutting force the most when the cutting depth is 100 μm and the cutting speed is 200 mm/s; The ultrasonic effect reduces the cutting temperature the most when the cutting depth is 20 μm and the cutting speed is 600 mm/s.