Design and Experimental Research of Textured Lapping Plate for Sapphire Machining
WAN Linlin1, 2, GUO Jinwei1, 2, LIU Wei1, 2, ZHANG Xianyang1, 2, RAN Xiaoru3
1. Hunan University of Science and Technology, Xiangtan 411201, China;
2. Hunan Key Laboratory of High Efficiency and Precision Machining of Difficult-to-Machining Materials, Xiangtan 411201, China;
3. Hunan Jove Precision Machine Co., Ltd., Xiangtan 411200, China
摘要蓝宝石晶片在研磨加工中会受到诸多因素的影响，为了提高蓝宝石研磨加工后的表面质量，本文从研磨液体积分布及流动均匀性出发，设计了研磨盘表面纹理。采用有限元计算对所设计的研磨盘进行流场模拟，同时对研磨盘表面应力分布进行了有限元模拟。为了验证研磨盘的加工性能，将所设计的研磨盘与无槽研磨盘进行研磨试验的对比。结果表明，采用槽宽2 mm、槽深1 mm 的阿基米德螺旋线沟槽加径向沟槽的设计，蓝宝石晶片表面粗糙度为0.210 μm，晶片表面无破碎、凹坑等损伤，加工效果明显优于无槽研磨盘，因此，本文所设计的研磨盘具有更好的加工性能。
Sapphire wafers are affected by many factors during the lapping machining, In order to improve the surface quality of the sapphire lapping machining, by consideration of the volume distribution and flow uniformity of the lapping liquid, the surface texture of the lapping plate is designed. The finite element method is used to simulate the flow field of the designed lapping plate. At the same time, the stress distribution on the surface of lapping plate was simulated by finite element method. In order to verify the processing performance of the lapping plate, the designed lapping plate is compared with the ordinary lapping plate in the lapping experiment. The results show that the design of Archimedes spiral groove plus radial groove with groove width of 2 mm and groove depth of 1 mm is adopted, the surface roughness of the sapphire wafer reaches 0.210 μm, the surface of the wafer has no damage such as crushing and pits, the effect is significantly better than the ordinary lapping plate, therefore the lapping plate designed in this paper has better machining performance.
2023, 
