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Application of Al & Cu Combinated Heat Sink to Laser Cooling System |
ZHANG Yimin1, YIN Qing2, GAO Guangbo1 |
1. AVIC Manufacturing Technology Institute, Beijing 100024, China;
2. Zeta Electronics Co., Ltd., Shenzhen 518110, China |
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Abstract In order to obtain a miniaturization and light weight solid-state laser, the diode pump cooling system need to reduce its weight, a solution based on Al & Cu combinated heat sink with thermoelectric coolers is proposed. The software Flotherm is used to optimize the design of heat sink, and then verify the cooling system in the actual use of the environment. The experimental results show that the designed scheme meets the requirements of solid-state laser cooling demand, the weight loss design of the pump module cooling system has been carried out.
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