Surface Integrity of IC10 Directionally Solidified Superalloy in Creep Feed Grinding
YANG Zhongxue1, ZHANG Shuaiqi2, ZHANG Qiang2
1. Key Laboratory of Contemporary Design and Integrated Manufacturing Technology, Ministry of Education, Northwestern Polytechnical University, Xi’an 710072, China;
2. The Key Laboratory of Advanced High Temperature Structural Materials, Beijing Institute of Aeronautical Materials, Beijing 100095, China
Different combination of grinding process parameters are designed to research the surface integrity of IC10 directionally solidified superalloy in creep feed grinding. The effects of process parameters on the surface roughness, surface topography, microhardness and microstructure alteration of the subsurface are investigated in detail. The results show that a better surface quality can be obtained during creep feed grinding of IC10 superalloy under the conditions: the wheel speed ranges from 15 to 20m/s, the workpiece speed is not more than 200mm/min, and the grinding depth is not more than 0.5mm. In addition, surface hardening phenomenon appears on the ground surface, the maximum hardening degree can reach 26.9% and the maximum depth of the hardened layer is 230μm. At the same time, the white layer and plastic deformation layer are produced in the subsurface, the depth of the white layer and deformation layer ranges from 0.24μm to 3.2μm and 0.48μm to 3.8μm respectively.
引用本文:
杨忠学,张帅奇,张强. IC10 定向凝固高温合金缓进给磨削表面完整性研究[J]. 航空制造技术, 2019, 62(6): 62-70.
YANG Zhongxue, ZHANG Shuaiqi, ZHANG Qiang. Surface Integrity of IC10 Directionally Solidified Superalloy in Creep Feed Grinding. Aeronautical Manufacturing Technology, 2019, 62(6): 62-70.