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| Fabrication of Microfluidic Chip Mold Based on Electrochemical Etching and Micro-Electroforming |
| DU Liqun1,2, LI Qingfeng2, LI Yuanqi2, ZHAO Wenjun2 |
(1. Key Laboratory for Precision and Non-Traditional Machining Technology of the Ministry of Education,
Dalian University of Technology, Dalian 116024, China;
2. Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology,
Dalian 116024, China) |
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Abstract The performance of microfluidic chip mold is subject to the adhesion strength between electroforming
layer and substrate in micro-electroforming process. In order to remedy this defect, a novel, lithograph-based method
combining through-mask electrochemical etching and micro-electroforming is presented, by which the nickel double cross
microfluidic chip mold with high adhesion has been successfully fabricated. According to experimental studies on process
parameters, not only optimal parameters were yielded, but also issues like the failure of interfacial delamination due to
pickling and lateral corrosion caused by electrochemical etching were further solved. The interface adhesion strength can
be determined by shearing strength between electroforming layer and substrate so that the influence of pickling and etching
on interfacial adhesion strength can be analyzed quantitatively. The results of the experiments indicate that the shearing
strength after pickling (25℃ , 20s) and etching(30℃, 5min) is increased by 98.5% and 203.6% respectively, compared with
that of untreated samples. Furthermore, the shearing strength of samples etched is 53.0% higher than that of samples after
pickling treatment. The method presented in this paper can effectively improve the adhesion strength between the electroforming
layer and the substrate. Additionally, the service life of microfluidic chip mold can be prolonged.
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2017, 
