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| Research on Forming Process and Packaging Technology of High Density Metal Microchannel Heat-Sink |
| ZHAO Wen1, LÜ Hui2, ZHAI Ke1, SONG Mancang1, WEI Zhuangzhuang1, JI Xuechao1, DU Liqun1 |
1. Key Laboratory for Precision and Non-Traditional Machining Technology of the Ministry of Education, Dalian University of Technology, Dalian 116024, China;
2. The 14th Research Institute of China Electronics Technology Group Corporation, Nanjing 210039, China |
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Abstract The processing technology of high density metal microchannel heat-sink was studied. Based on UV– LIGA technology, the high density mental microchannel plate with 100μm in width and over 500μm in height was fabricated. Then the microchannel plate and the cover plate were packaged. Aimed at the problem that the sealing surface of the high density mental microchannel heat-sink can not be completely bonded when packaging, a novel method based on transition layer compensation was proposed. In order to meet the requirements of air tightness, a shear experiment was carried out in which the shear strength of silver paste, epoxy resin and solder paste were compared. The result shows that the solder paste has the largest shear strength and effect of surface roughness on the bonding strength was further explored. A metal microchannel heat-sink was fabricated based on above technologies. There is no leakage in 2MPa hydraulic seal test, which satisfies the design requirement.
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2019, 
