|
|
|
| Optimization of a Pulse Electorplating Copper Process for Improving Carburization Resistance |
| LI Hanye, SUN Huiyan, YUAN Fuhe |
| (AECC Shenyang Liming Aero-Engine Corporation Ltd., Shenyang 110043, China) |
|
|
|
Abstract A copper electroplating process is optimized to realize an effective local protection of non-carburization
areas of aeroengine components. The primary, minor parameters of a pulse electroplating copper process are identified and
optimized in the present work through orthogonal experiment and range analysis. The copper plating deposited using the
optimized pulse process demonstrates an excellent interface adhesion state, with surface morphology, porosity and carburization
resistance better than that electroplated using a direct current. The thickness of the copper plating might be decreased
to 20μm from 50-70μm using the optimized pulse electroplating copper process, thereby saves the cost and enhance the efficiency
of copper electroplating production.
|
|
|
|
|
|
|
|
|
2017, 
