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| Numerical Simulation Study of the Curing Process of Large Thickness Composits Laminate |
| XU Peng, YAN Dongxiu, LIU Weiping, SUN Kai, KONG Jiaoyue, DONG Liushan |
| ( Institute of Aeronautical Manufacturing Technology, Shanghai Aircraft Manufacturing Corporation Ltd., Shanghai 200070, China) |
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Abstract Numerical simulation method was employed to study the curing process of large thickness laminate with
the resin of X850 toughened epoxy. Two different curing cycles was studied to analysis the heat release and the highest
temperature in the center when curing. At last, experimental data was used to estimate the accuracy of the theoretical model.
The result shows that overshoot of temperature occurs in the middle layer because of rapid heating, which will impact the
quality of products, and this unfavorable influence can be eliminated by low heating rate. Meanwhile, the experimental data
was used to estimate the simulation model. For the simulation result fits the experiment date very well that the model in this
study can be considered suitable for the prediction of the curing process and the temperature history of X850 resin system
composites.
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2017, 
