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Aeronautical Manufacturing Technology
2016
,
Issue (19)
: 64-69
DOI
: 10.16080/j.issn1671-833x.2016.19.064
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http://www.amte.net.cn/EN/10.16080/j.issn1671-833x.2016.19.064
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http://www.amte.net.cn/EN/Y2016/V59/I19/64
[1]
KOU Lulu, QU Wenqing, ZHUANG Hongshou.
Effects of Trace Element on Properties of Sn–3.5Ag–0.7Cu Lead-Free Solder
[J]. Aeronautical Manufacturing Technology, 2020, 63(8): 87-92.
Copyright © Editorial Board of Aeronautical Manufacturing Technology
Supported by:
Beijing Magtech
2016, Issue (19): 64-69 DOI: 10.16080/j.issn1671-833x.2016.19.064
