Study on Uniformity of Assembled Inertial Switch in Megasonic-Assisted Microelectroforming Process
DU Liqun1, 2, DONG Yakun2, GUO Bingjiang2, CAI Xiaoke2, WANG Shuai2, LI Jingmin1, 2
1. Key Laboratory for Precision and Non-Traditional Machining Technology of the Ministry of Education, Dalian University of Technology, Dalian 116024, China;
2. Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, Dalian 116024, China
The edge effect of the electric field in the assembled inertial switch electroforming will disturb the uniform distribution of the power lines between the anode and the cathode. This leads to the problem of poor uniformity of electroforming layer thickness, which prolongates the production cycle. In order to shorten the production cycle of the assembled inertial switch, the megasonic is introduced into the microelectroforming process in this paper. The slider structure has the worst electroforming uniformity in the assembled inertial switch. This paper focuses on how to improve the microelectroforming layer uniformity of the slider structure. Firstly, the current density distribution and layer thickness distribution in the process of electroforming process are simulated by COMSOL finite element analysis software. The simulation results indicate that, compared with the electroforming process without megasonic, the thickness of microstructure obtained by megasonic-assisted electroforming is more uniform. With the increase of megasonic power density, the layer thickness uniformity is better. Secondly, on the basis of simulation, megasonic-assisted electroforming experiment is carried out. Compared with the electroforming process without megasonic, the thickness uniformity of the megasonic-assisted microelectroforming with simultaneous left and right vibration and power density is 2.4 W/cm2 is improved by 51.78%. The simulation results are basically consistent with the experimental results. According to the above research results, the assembled inertial switch with the size of 20 mm×20 mm and the height of 900 μm is made by introducing the simultaneous left and right vibration megasonic with the power density of 2.4 W/cm2 into the microelectroforming process. The switch meets the design requirement. Compared with the microelectroforming process without megasonic, the manufacturing time of the assembled inertial switch made by megasonic-assisted microelectroforming is reduced by 25%.
基金资助:国家重点研发计划(2020YFB2009002);国家自然科学基金(51975103)
作者简介: 杜立群,教授,博士,研究方向为电化学加工和MEMS 工艺技术。
引用本文:
杜立群,董雅坤,郭柄江,蔡小可,王帅,李经民. 装配式惯性开关的兆声辅助微电铸均匀性研究[J]. 航空制造技术, 2023, 66(13): 14-21.
DU Liqun, DONG Yakun, GUO Bingjiang, CAI Xiaoke, WANG Shuai, LI Jingmin. Study on Uniformity of Assembled Inertial Switch in Megasonic-Assisted Microelectroforming Process[J]. Aeronautical Manufacturing Technology, 2023, 66(13): 14-21.