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TA15 Titanium Alloy Superplastic Forming/Diffusion Bonding of Ultra-Thin Hollow Four-Layer Structure for Integrated Forming and Precision Control |
ZHANG Jinyuan1, QIN Lidong2, LIU Taiying3, JIANG Shaosong1, 4, PENG Peng1, LI Yang1 |
1. State Key Laboratory of Metal Precision Hot Processing, Harbin Institute of Technology, Harbin 150001, China;
2. Capital Aerospace Machinery Corporation Limited, Beijing 100076, China;
3. Beijing Xinghang Electro-Mechanical Equipment Co., Ltd., Beijing 100074, China;
4. Harbin Hangyu Jingchuang Technology Co., Ltd., Harbin 150010, China |
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Abstract The SPF/DB process of ultra-thin hollow four-layer structure was investigated by using TA15 titanium alloy hot rolled sheet. Firstly, the superplastic deformation behavior of TA15 titanium alloy in the process temperature range was studied by tensile test, and the corresponding stress–strain curves were obtained. Then, finite element software was used to simulate the design of the four-layer longitudinal reinforcement structure with thin-walled transverse local penetration, and the distribution of wall thickness reduction and stress concentration during the forming process is determined, which provides effective guidance for the subsequent diffusion bonding test. Finally, an ultra-thin hollow fourlayer structure with good vertical ribs and a triangular zone width of only 0.9 mm was successfully prepared. The maximum thinning rate of the panel was 18.6%, the maximum thinning rate of the core plate was 55.1%, and the bonding rate of the diffusion bonding area between the core plate and the panel was 92.1% – 98.5 %. The original microstructure of TA15 sheet for forming is fine, broken and equiaxed, the average grain size is less than 5 μm. After long-term superplastic deformation and thermal exposure, the grain size grows significantly.
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[1] |
ZHAO Bing, YANG Yi, LI Zhiqiang, MU Yanhong, LIU Shengjing, ZHANG Bin, ZHANG Chao, SUN Chaoyang, LIU Yang, WANG Xinzhu, CHU Xingrong, HAN Shu. Research on SPF/DB Process and Properties of Titanium Alloy Hollow Lattice[J]. Aeronautical Manufacturing Technology, 2023, 66(9): 24-35. |
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