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| Study on Lithography of High-Precision AZ Thick Photoresist and Its Application in Micro RF Coaxial Transmitter |
| DU LiQun1,2, LI Yuanqi2, QI Leijie2, LI Xiaojun2, ZHU Heqing2, ZHAO Wen2, RUAN Jiufu3 |
1. Key Laboratory for Precision and Non-Traditional Machining Technology of the Ministry of Education,Dalian University of Technology, Dalian 116024, China;
2. Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology,Dalian 116024, China;
3. Academy of Photoelectric Technology, Hefei University of Technology, Hefei 230009, China |
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Abstract Based on UV-LIGA technology, a novel passive RF coaxial transmitter was fabricated on a metal substrate by combining positive and negative photoresist. Aiming at low dimensional accuracy of thick positive photoresist AZ50XT caused by the uneven distribution of exposure dose within the resist, the method of multiple exposure and development was proposed to make high-precision electroforming mask. The effect of this method on dimensional accuracy was studied by lithography experiment of different size graphics. The experiment results show that the method of multiple exposure and development can significantly improve the dimensional accuracy of AZ50XT resist and the accuracy of the lithography pattern is no related to the mask size. Finally, based on the experiment results, a kind of passive coaxial transmitter was fabricated. The overall dimension is 3000μm×400μm×200μm, the maximum height of single layer is 60μm and the sidewall inclination of each layer is more than 85°.
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2018, 
