Fabrication of Large Aspect Ratio Stepped Copper Microcolumn Array
DU Liqun1, 2, YUAN Bowen2, KONG Dejian2, WANG Shuai2, CAI Xiaoke2, WANG Shengyi2, XIAO Haitao2
1. Key Laboratory for Precision and Non-Traditional Machining Technology of the Ministry of Education,
Dalian University of Technology, Dalian 116024, China;
2. Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology,
Dalian 116024, China
In this paper, a stepped copper microcolumn array was fabricated based on the micro-electroforming process of THB–151N photoresist. In order to solve the problem of difficult development of 20 μm micro-blind hole and film retention at the bottom during THB–151N photoresist development, a submerged bidirectional megasonic assisted development method was proposed. The influence of megasonic power density and aspect ratio of micro-blind hole on mass transfer process of developer was simulated. The megasonic power density and aspect ratio of micro-blind hole were optimized, and the megasonic assisted development was studied experimentally. At the same time, aiming at the poor verticality of sidewall of the micro-blind hole due to inappropriate exposure dose of THB–151N film，the effect of exposure dose on the verticality of sidewall of the micro-blind hole was discussed by lithography experiment，the empirical equation of preferred exposure dose and film thickness was fitted. On the basis of the above technological methods and experimental study, 4×6 stepped copper microcolumn arrays with a height of 300 μm, overall aspect ratio of 15∶1 and minimum side length of 20 μm were fabricated.
杜立群，袁博文，孔德健，王帅，蔡小可，王胜羿，肖海涛. 大高宽比阶梯型铜微柱阵列的制作[J]. 航空制造技术, 2023, 66(10): 14-20.
DU Liqun, YUAN Bowen, KONG Dejian, WANG Shuai, CAI Xiaoke, WANG Shengyi, XIAO Haitao. Fabrication of Large Aspect Ratio Stepped Copper Microcolumn Array[J]. Aeronautical Manufacturing Technology, 2023, 66(10): 14-20.
