Abstract：The current density in the interconnecting solder joint is increased signifi cantly, which brings new challenges to the reliability of electronic products. Finite element software is used to simulate the distribution of temperature and current density in BGA package solder joints, the numerical simulation results show that there is a great temperature difference between chip side and substrate side of solder joints, the maximum temperature gradient reaches 5.38×103K/cm, the current crowding exists at the entrance/exit of current in solder joints, the current density is 2-3 orders of magnitude higher than the average one. Meanwhile, the results of simulation are also compared with the well-designed experiment, which are in good agreement with the actual experimental ones.
2011, 
