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| Simulation and Experimental Study of SiCp /Al Composite Based on Single Abrasive Grinding |
| YANG Hui1, JIANG Bingchun1, TANG Cheng1, LIU Wei2 |
1. Guangdong University of Science and Technology, Dongguan 523000, China;
2. Hunan University of Science and Technology, Xiangtan 411201, China |
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Abstract The experiment and three-dimensional finite element simulation of single diamond abrasive grinding SiCp /Al composites are carried out. The effects of grinding parameters on grinding force and surface morphology of SiCp /Al composites were analyzed. The analysis results show that the grinding force decreases with the grinding speed increasing, the breakage of SiC particles is alleviated, the coating effect of aluminum matrix is enhanced, and the surface morphology integrity is good. The grinding force increases with the grinding depth increasing, SiC particle breakage is significantly enhanced, more pits and holes are formed on the surface, and the surface quality is poor. The simulation results are consistent with the experimental results, which shows that the model can be used to optimize the grinding process parameters.
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