The soldering test of gold alloy sheet and silver plated copper wire in conductive ring by using eutectic SnPb solder and self-made InPbAg solder was carried out. The microstructure, compound composition, micro-hardness and mechanical property of the two kinds of soldering joints were compared and analyzed, and the influence of the self-made InPbAg solder on the brittleness of t he joints was discussed. The results show that the SnPb solder / gold alloy interface produces a layered IMC layer, and the composition is brittle intermetallic compounds of AuSn₂, AuSn₄, Ag₃Sn; IMC layer of InPbAg solder / gold alloy interface is very thin with the composition of AuIn₂, Ag₂In phase, and their hardness are all lower than that of SnPb joint, which indicates that the brittleness of InPbAg intermetallic compound is relatively low. The mechanical property analysis shows that the mechanical properties of InPbAg joints are relatively stable, SnPb joints are brittle fracture, and InPbAg joints are plastic fracture.