李志欣, 曾晗鹏, 李天旭, et al. A Review on Multi-Energy Field Assisted Spinning Forming of High-Performance Thin-Walled Components[J]. Aeronautical Manufacturing Technology, 2026, 69(7).
DOI:
李志欣, 曾晗鹏, 李天旭, et al. A Review on Multi-Energy Field Assisted Spinning Forming of High-Performance Thin-Walled Components[J]. Aeronautical Manufacturing Technology, 2026, 69(7). DOI: 10.16080/j.issn1671-833x.25010185.
A Review on Multi-Energy Field Assisted Spinning Forming of High-Performance Thin-Walled Components
High-performance thin-walled components are critical and urgently needed parts in fields such as aerospace
boasting broad application prospects. Spinning technology has emerged as an effective technical pathway for the integrated manufacturing and performance enhancement of such components. However
these components are frequently manufactured from hard-to-deform materials
which makes them prone to defects such as wrinkling
cracking
and poor mold conformity during the spinning process due to significant uneven deformation. These challenges constrain the highperformance manufacturing and application of these components. In recent years
to improve their formability
research has progressively introduced various energy fields including electric
magnetic
ultrasonic
and laser into the spinning process
leading to extensive studies on multi-energy field assisted forming. This paper reviews the research progress in applying multi-energy fields to achieve high-performance manufacturing in the spinning of thin-walled components. Firstly
it compares the mechanisms of different energy fields on hard-to-deform materials and their influence on the spinning process and forming quality. Subsequently
it analyzes the key finite element modeling technologies related to the multi-energy field assisted spinning process. Finally
based on the comparative analysis
the advantages and limitations of each energy field in spinning are summarized
and the remaining challenges along with future development directions for multi-energy field assisted spinning technology of high-performance thin-walled components are discussed.