The life of the blades is affected in varying degrees by traditional micro pore machining techniques like drilling and EDM, which cannot match the requirements of high precision and high quality of the holes due to issues like significant taper, recast layer, and cracks during the machining process. Different from traditional mechanical processing, laser processing micro-holes is a high-precision processing method. However, since the spatter cannot completely expel the pores, a recast layer is formed on the hole wall, which affects the quality of the vias. In this paper, the simulation study of the femtosecond laser processing process of micro-holes is carried out and the morphology changes of the micro-holes from the beginning of ablation to the end of the micro-holes are analyzed, and then by changing different laser parameters, it is concluded that the thickness of the recast layer is affected by the laser power and pulse width, and the thickness of the recast layer can be reduced by increasing the power, but the power cannot be increased indefinitely, which will cause excessive ablation, and the pulse width does not show a simple linear relationship with the thickness of the recast layer. In order to reduce the thickness of the recasting layer, a processing method of reaming is proposed, which is to process micropores that are smaller than the actual requirements, and then expand the holes. It is verified by experiments that reaming can significantly improve the quality of micro-pores.